PRODUCTS
Optical Communication Applicat
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Active Component Manufacturing
- Optical LD & PD Wafer
- Aspherical Lens and Cap
- TEC Device
- 2.5G-10G APD CHIP
- 10G PIN PD CHIP
- Transimpedance Amplifier
- Aluminum Nitride Substrates
- Alumina substrates
- High Temperature Co-fired Substrates (HTCC)
- 10G CWDM DFB Chip
- Microlens Array
- Smile Corrector
- Slow Axis Collimators（SAC）
- Fast Axis Collimators Arrays（FACA）
- MEMS Mirror
- SOI Wafers
- Super-thick Thermal Oxidized Wafers
- 25G DFB Laser Diode Chip
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Test and Measurement
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High Speed Qptical Transceiver
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Optical Transport Network Devi
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Network, Security and Delivery
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Optical Automation Equipments
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Passive Component Manufacturin
Industrial Laser and Optical A
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Lasers
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Laser Drivers
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Controller Electronics
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Optical Components
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Materials
Solutions
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BOSA Manufacturing and Packagi
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ECDL Stable Laser Solution
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Laser Spectroscopy Solution
Host Connectors and Plug Connectors
Main Products
CFP2/CFP4/QSFP+ Host/Plug Connectors
ATCA/MicroTCAconnectors
QSFP+ Host Connector
Features
· eQSFP+ Multi-Source Agreement (MSA) compliant
· Transmission characteristics: 32Gbps/ch, 4ch=128Gbps/connector
· Compatible with existing QSFP module (Infiniband: QDR / FDR / EDR)
· Fully compatible foot pattern with existing QSFP connector
· Contact area plating variation: Au 0.76μm min. or Au 0.38μm min.
· Lead-free soldering capable
· Tape and reel packaging
· Mechanical Kit available
· RoHS compliant
Supplier
Yamaichiwas incorporated as a business corporation in 1956. By continuing to supply Yamaichi range of high quality and reliable components, we are proud to make major contributions to the development of the industries that are fulfilling today’s wide-ranging information technology requirements.
